Lattice announced production iCE40?” Los Angeles” mobileFPGA? Device

May 20, 2012 at 2:40 pm · Filed under ic industry trends ·Tagged

Lattice Semiconductor Corporation announced recently issued 8has been fully in line with the production of standard iCE40than” Los Angeles” mobileFPGA TM series devices,OP97EPZ datasheet, and start mass production. ICE40low power LP series of LP640, LP1K, LP4K and LP8K devices, as well as a high performance iCE40HX series HX640, HX1K, HX4K and HX8K devices, have begun to mass production, and has17 different devices / package assembly.

ICE40mobileFPGA device using nonvolatile40nm process, followed has been a large number of commercial and consumer electronics OEM manufacturers widely used the successful 65nm iCE65 TM series characteristic, its flexibility, low power consumption, low cost and small package edge, helps in shortening the development cycle, the rapid development of new innovative consumer electronics product.

” We are very happy to reach the production milepost”, lattice company vice president and consumer services department general manager, Kapil Shankar said,” these non-volatile40nm device has quickly by our customers use. We expect this quarter cumulative shipments over one million pieces.”

Easy to use development kit

By using two new iCEblink TM development kit, engineers can easily evaluate and adopt nonvolatile iCE40 technology. ICEblink40-HX ( new energy) development kit with a iCE40HX1K-VQ100 devices, iCEblink40-LP ( low power ) with a iCE40LP1K-QN84 device development kit. The two parts are provided with a 1280 lookup table logic,64Kbit on-chip memory and the 67 user I / O. Using the USB interface connected to the iCEblink40development kit includes the functions:1Mbit SPI flash, capacitive touch button, LED and I / O access to all users. Read the rest of this entry »

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Beyond the Intel TSMC jumped logic IC brother

May 20, 2012 at 2:39 pm · Filed under Core product release ·Tagged

TSMC global business and marketing senior vice president Chen Junsheng announced a few days ago,ADE7566 price, last year the stage accumulates total capacity has been the leading Intel, Samsung, the largest global logic IC factory first, stage 28nm is the biggest challenge capacity, TSMC has substantially expanded due to the demand, the first quarter of next year will be fully meet customer.

Wafer foundry leading TSMC yesterday held a forum, the theme is ” customer trust in the technology and production capacity of suppliers, TSMC currently remains the only industry with28 nm of foundry. TSM total last year production capacity of about13220000when approximately8 inch wafer, by 17%, to maintain capacity bibcock position, from 2009to 2015, TSMC annual capacity of compound increase rate ( CAGR ) at31%, echoing the high capital expenditure investment results.

TSMC product development manager Qin Yongpei cited the semiconductor equipment and Materials International ( SEMI ), excluding the memory capacity of the manufacturers, TSM total production last year leading Intel1.5 times, also lead the Samsung2 times, ranking the first in the world in.

Qin Yongpei said, TSMC is not just a global logic semiconductor production capacity the largest supplier,” effective capacity” behaved similarly brisk, the TSM40 nanometers below the advanced process, the number of defects per unit area ( D0) of less than 0.06,28nano fabrication yield also continued to improve, by the end of the D0 can reach 0.1level, because D0 is the yield of wafers is one of the important parameters, display TSMC production technology center.

On TSMC this semiconductor industry, mobile computing the huge business opportunities, but also test technical complexity. Chen Junsheng points out, TSMC80% of customers for IC design factory, this year with logic based semiconductor industry output growth rate of about 2% to 3%, but the light is IC design part of annual growth rate of 10%, in the mobile computing market driven, TSMC would therefore benefit.

Chen Junsheng points out,2010mobile phone shipments of wisdom beyond personal computer, intelligent mobile phone this year shipments will exceed personal computer even more, coupled with flat computer high growth, mobile computing will be a few years this drive electronic industry killer application, due to the action of operation market booming, before 2015there will be high up to 119000000000USD action trading opportunities.

Chen Junsheng puts forward, intelligent mobile phone has become one of the most important Internet device, the future of various function will be integrated in a mobile computing device to bank transactions, for example, is expected in 2015before the use of intelligence mobile phone banking transactions users will be more than 500000000 people, in 2015through the action device for electronic payment of $670000000.

News of28 nm

In a semiconductor,28 nm linewidth” means” the thickness of28 nm,40nm of next generation technology,40 nm is 65nanometers in next generation technology.

Smaller linewidth represents the transistor size smaller, the linewidth is finer, less components, each chip can store data volume is bigger, faster, smaller chip is suitable for mobile computing and other apparatus, with thin short, energy saving, efficient demand. Read the rest of this entry »

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CMO board Bianzhen Hon Hai or integrate panel resources

May 19, 2012 at 6:30 am · Filed under Core product release ·Tagged

Recently,LM2704 datasheet, Taiwan Regional Panel giant CMO director will produce major change, Chi Mei Industrial representative shareholder exit, the second largest shareholder of Hon Hai will further lead the board of directors. Previously, Hon Hai has share sharp ten generation line.

The analyst thinks, Hon Hai will be on next or CMO and sharp panel resources.

The CMO15 held a meeting of the board, representing the Chi Mei Industrial corporate directors Lin Qingsheng and two supervisors resigned at the same time, came into force from June 28th.

In2009, the financial crisis under pressure, CMO and Hon Hai ‘s panel enterprise group a merger, Hon Hai shares in Chi Mei12%, to become the second largest shareholder. Chi Mei wants to expand the panel” sea”, Hon Hai is the chance to expand upstream resources.

However, both conformity effect is not ideal, Chi Mei Industrial still controls the actual power of management, the CMO customer relationship, development direction and no change. Therefore, the CMO management status improved little. The first quarter of this year, the CMO is the seven consecutive quarter of losses, although the loss narrowed, but still reached12766000000 yuan nt.

In December last year, CMO chairman Liao Jinxiang resigned. At the beginning of this year, the original group a general manager, then the CMO vice chairman Duan Hang was promoted to chairman.

” The Chi Mei Industrial withdraw from the board of directors, two years before the continuation of the merger.” Group consultancy research director Li Yaqin to the” First Financial Daily” said, Hon Hai will inherit the CMO ‘s actual operating rights, so as to serve the overall interests of Hon hai. CMO also will by” take the customer as the center”, into ” to the group internal interests as the center”. This will be conducive to long-term development of real beauty, expand the “access to the sea”.

Display Search China Research Director Zhang Bing thinks, in flat panel industry enters mature period, brand, channel, terminal is the most important, capacity, technology becomes secondary. Chi Mei Industrial quit the board, let the indirect holding brand terminal manufacturing large family Hon Hai to operate, in order to expand the CMO panel shipping channel.

Openwave Advisory Panel Display Research Assistant General Manager Li Qiuwei said:” Chi Mei Industrial do not want to play, want to find someone to take over.” But Hon Hai does not necessarily take Chi Mei Industrial equity for all has been taken over, because the CMO does not make money.

Li Qiuwei speculated, Chi Mei feed many Taiwan area employment population, so the local Taiwan might ask Hon Hai shares Holdings cmo. At present, Chi Mei Industrial Holdings CMO17%, Hon Hai simply overweight small stakes can be jumped to the major shareholders.

In fact, strengthen the CMO resources integration, it is Hon Hai. Said Li Yaqin, Hon Hai has an” eye “, to get through panel, manufacturing, channel three links, become consumer electronics” empire”. But the real control of Chi Mei, and with sharp panel integration resources, they can serve the aim.

Zhang Bing also believes that the future, Hon Hai will become a huge system and platform, can integrate the upper panel, machine manufacturing, the downstream channel resource. At present, Hon Hai is apple, Sony, sharp ‘s main factory, and master the Chimei and sharp ten generation line half again as long as productivity, through the brand and sales terminals, can achieve the grandiose dream.

But Li Qiuwei thinks, Chi Mei and sharp panel in the capital level cooperation, temporarily is unlikely. Because share sharp ten generation line is Hon Hai ‘s Foxconn, both shareholders were not consistent, but still sharp for its ten generation lines of large shareholders, it does not necessarily willing.

” Hon Hai coordinating CMO, sharp panel production, it is feasible.” Said Li Qiuwei, Chi Mei4.5generation line,5.5line,6line,7.5line and 8.5line generation, with sharp line between ten generations, for a specialized division of labor, improve efficiency.

In March this year, Hon Hai to $809000000in the ten generation of sharp lines, and obtain the sharp ten generation line half capacity. At the same time, Sharp Corporation to Hon Hai Department of the four affiliated company directed additional shares, the Hon Hai overall holding a sharp9.88% stake, becoming the second largest shareholder sharp corporation. Read the rest of this entry »

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LG sharp or new iPhone 4 inch screen order

May 19, 2012 at 6:28 am · Filed under Core product release ·Tagged

Quoted an informed source reports,DP8311 price, apple ( Apple ) ( AAPL-US ) has been to Asia panel factory orders the next generation iPhone smart mobile phone screen, diagonal size will be available3.5 inch expands to 4inches, and scheduled the next month production. The LG, sharp, Japan and South Korea panel suppliers will obtain apple production orders, the quickest next month.

The report also says, new iPhone screen has 3Korean panel suppliers began the initial production, including South Korea LG display ( LGDisplay ) (034220-KR ), Japan’s sharp ( Sharp ) (6753-JP ) and the Japanese government leader and three panel factory ( Sony, Toshiba and Hitachi ) set up a joint venture of the Japanese companies display (JapanDisplay ). ” Reuters” pointed out that, if the new iPhone screen is expanded to 4inch, if Apple maintains the original aspect ratio, mean new screen visual area will increase about 30%. Apple introduced since 2007since the first generation iPhone, never changed3.5 inch screen size.

Two reports were known, if Apple really iPhone screen is pulled big, reflected from the rival South Korea SamSung ( Samsung ) (005930-KR ) competitive pressure. Samsung released earlier this month the company a new generation of machine emperor GalaxySIII,4.8inch touch screen mobile phone, dimensions in the wisdom of king, and with a faster processor. Read the rest of this entry »

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MEMS: intelligent machine and automotive electronic contribution rate of more than 60%

May 18, 2012 at 2:31 pm · Filed under ic industry trends ·Tagged

The development of any industry is inseparable from the overall global economy environment influence,MAZ4200-L datasheet, such as MEMS industry. Semiconductor market research agency Semico Research technical director Tony Massimini thinks, at present global economic weakness. The main reasons include:1people generally worry about political and economic instability, so do not dare to spend money. 2from the sales, car already restored boom in Japan, but after the earthquake, the auto industry is still very slow recovery. 3 industrial orders growth to slow. 4short term, no positive incentives can change the present situation of economic stagnation.

In macroscopical economy index, following the 2010Global GDP growth of 4.9%, expected 2011growth will fall to3.8%,2012 could reach 4.5%. Main driving force comes from: OEM manufacturers will be in the fourth quarter of2011third and digest the previous inventory; Europe and the United States economy may appear.

Industry market analysis

Tony Massimini said, the second half of 2011, the PC market’s overall performance was disappointing. Desktop and server motherboard market in third, the 4 quarter glides continuously; AMD CPU supply pressure, and Nvidia fall released 28nmGPU to AMD to PC to weigh; school than in former years also weak demand. In addition, compared with the strong demand in emerging market countries, the European PC market is still weak.

Mobile phone market presents a joy several depression. Intelligent mobile phone market is the only park, intelligent mobile phone PCB supply in the third quarter to maintain more than 10% growth, while the other mobile phone market segments in third, the 4 quarter is just passable performance.

Consumer electronics, in addition to iPad one branch alone beautiful, set-top box, DVD player, digital video, digital camera, HDTV, MP3 and the PCB e-reader shipments were lower than the quarter average.

Reflect the global semiconductor sales of the Semico IPI index in the third quarter of 2011to the first half of 2012, will be out xianyihouyang curves, inflection point may appear in 2012February.

Semico Research to make the forecast assumptions is, terminal products will use more memory, RF, MEMS, application and baseband processor and semiconductor chip; consumers to buy HDTV, set-top box, digital cameras and video games and other products of desire is not strong; the 2011 / 2012market new capacity slow growth; capital spending; overall chip average price decline; supply chain tightening, cumulative inventory to be released; market overreaction on recession.

Semico Research thought, including passenger cars and commercial vehicles, car market growth will resume ( see Figure 2), which is also the largest MEMS application market. Mobile phone will transfer to the high-end market,2011, intelligent mobile phone in MEMS product sales accounted for20%,2011 and 2015, the average annual compound growth rate will reach 38%. Intelligent mobile phone in 2014 will replace the car, become MEMS maximum application market. In addition, including flat panel computer, notebook, the whole calculation server market in 2011 ~2015 will maintain continuous growth

In 2015, the global MEMS market revenue will reach 11800000000 dollar

Market research firm iSuppli MEMS and sensor industry analyst Jeremie Bouchaud said the chief, in 2010, the global MEMS market revenue of approximately $7200000000, is expected in 2011for $7900000000, an increase of about 10%;2012 will grow to about $8800000000, by 2015 this figure will reach 11800000000dollar,2010~ 2015, the average growth rate of about 10.5%.

Intelligent mobile phone and automotive electronics — Application of MEMS two pillars

Semico Research research thought,5 years in the future, intelligent mobile phone and automotive electronics will be the MEMS application two big main market, they are on the overall size of the contribution rate in 60% above. From 2011 to 2015, according to MEMS product application areas of sales forecast as shown in figure 6. During this period, the average selling price of MEMS products will continue to decline, the average annual compound will decline to8.2% (see Figure 7). The industry boom will follow the mainstream semiconductor product cycles and changes.

Semico Research Tony Massimini, MEMS industry to maintain steady growth, need to establish a healthy ecological system, realizes the design tools, simulation, verification and packaging standards, and promote the development of other semiconductor devices.

ISuppli analysis and forecasting, consumer electronics and mobile MEMS market will increase from $1500000000 in 2010to $4400000000 in 2015, the average annual compound growth rate of approximately 22% ( see Figure 8). According to the2011report published in July,2012, MEMS technology will be used more handheld devices and other consumer electronic products ( Figure9). Intelligent mobile phone will continue to play a locomotive pulling effect; at the same time, flat panel computer will provide new opportunities for growth, it will actively promote the” Full PC tablet computer”; and the game of the future did not seem very hopeful, has reached a peak2010,2011 ~2012will decline,2014will walk out of trough, pick up L.

2011 product highlights are: TI handheld products in the MEMS thermopile, Knowles electronics MEMS stick game, still the manufacturer rolls out the RF MEMS converter / variable capacitance diode. The next 5 years, mobile phone and computer in motion sensors ( accelerometers, gyroscopes, pressure + Compass) is the popular technology of hot ( see Figure 10). But iSuppli on the remote motion sensor and MEMS speaker is not too optimistic, even thought the latter in2015will not have a decent market.

The field of automotive electronics, MEMS global market size will be increased from USD 1900000000 in 2010 to $2860000000 in 2015, the average annual compound growth rate of approximately 8.5% ( see Figure 11). Due to the Japanese on2011, global car sales may drop2200000in 2012, and the downward trend will continue.

Because of the laws and regulations of the car more and more stringent requirements, ESC, airbags and a tire pressure monitoring ( TPMS ) and other security applications will become mainstream, tire pressure monitoring will rise from 2015in China become a mandatory law. Energy saving and emission reduction in China will also become the driving force of the sensor market growth. In addition, the integration of sensor will cause prices to decline the rate of7-8%.

In industry, communication, medical electronics, military and civil aviation lights high value-added applications, MEMS global market size will be increased from USD 1500000000 in 2010 to $2700000000 in 2015, the average annual compound growth rate of approximately 12.3%. MEMS can not only reduce the industrial and civil energy consumption, also contribute to the energy development and exploration. ISuppli argues that in each of these areas, China has become the main MEMS application market.

MEMS supply chain evolution

Market Research and analysis firm Yole, MEMS supply chain structure is pregnant with new changes. The MEMS device can be used to replace function, such as a microphone; can also be used for new features, such as a microscope, RF MEMS tuned antenna; or combination of features, such as IMU, the function is to bring commercial model of revolution. In microphone field, some manufacturers of wafer, some manufacturers are focusing on packaging, sales sensor. In MEMS plants and IDM also appeared a kind of intermediate business model: some IDM specifically with their own design and production of the MEMS wafer, and the number of MEMS factories with their own product design and development platform. The MEMS industry another change is, in a module integrated chip, which began with6degrees of freedom ( DoF ) to 10degrees of freedom inertial module. At the same time that the high degree of integration, software and supply chain in the multiple challenges.

Yole detailed analysis of MEMS market several important changes in supply chain:

One,2016, consumer electronics in the field of inertial sensor will account for a large share of. In the game, mobile phone, computer and PMP application, may account for nearly 1/ 3 of the volume, and nearly 50% of sales.

In two, MEMS microphone of supply chain in the past few years have had no small change. For example, Infineon has transformed the microphone chip suppliers, supply Rui sound technology ( AAC Acoustics ), Hosiden, BSE, Goertek and other Asian microphone manufacturers; at the same time, MEMSTech and Omron and other other manufacturers are trying to become the place of pure plant microphone manufacturers.

In three, a bolometer detector, with the camera module is a camera manufacturer ‘s main business. This will further promote the integration and application of infrared detector.

Yole in 2011March released data show, TI, HP, Bosch and ST manufacturers such as global MEMS sales ranking in 201030. This year MEMS global market revenues of approximately $8700000000, shipped in 4300000000, in which the field of consumer electronics accounted for46%;2016revenue of $19600000000, shipped in 15800000000, revenue and volume of the compound annual growth rate is respectively 15% and24%. Among them, the largest share of inertia MEMS, microbolometer, oscillator and microfluidic chips and other new devices also have certain contribution.

Firm strategy analysis

A number of manufacturers from highly dispersed to the relative concentration of development, showed that the MEMS business is mature. In 2010, global sales of more than $100000000 in a manufacturer to have 21. Bosch, ST, Panasonic and other major manufacturers to become larger, small firms competitive situation more grim. Small scale and scattered manufacturers products will be very difficult and competitive, but focused on one or two kinds of technology products manufacturers still have certain market space for survival. ” If only a single product AKM, Knowles Electronics ( Knowles ), TI and Inkjet manufacturers, performance is also very good. Chip design, packaging, software and other technology division more and more special, this will become important in the future development trend.” Yole analyst Laurent Robin noted.

At present, ranking in the top 30 global manufacturers is the most integrated manufacturing company, the emergence of new changes, more and more manufacturers began offering OEM business; other manufacturers to take into account the cost and infrastructural factors, are being outsourced consumer device or part of specialized technology, thereby becoming light wafer manufacturer ( Fab-light ). For example, only Knowles and InvenSense belongs to a fabless manufacturer, HP, Lexmark, fly think of Carle, ADI ( Lexmark ), Infineon, VTI and many other manufacturers to light the wafer manufacturer. 30, there are a lot of fabless manufacturers or in development, or in the growth stage, the latter may later become big company, also may flower briefly as the broad-leaved epiphyllum.

Yole analysis of the report pointed out, the next few years of MEMS industry is the key. Those engaged in high value-added automotive electronics manufacturers will still retain the internal generation plant; into the field of consumer electronics manufacturers are more likely to use a form of outsourcing; and its own factory manufacturers of consumer electronics in order to survive, will have to try to increase market share, to offset the huge cost of infrastructure.

On behalf of the factory needs to pay close attention to mass application areas of the market, through the development of a new device suppliers or customers, in order to make the scale of production remained stable. Read the rest of this entry »

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Austria quantum chip considers to obtain major breakthrough

May 18, 2012 at 2:29 pm · Filed under Core product release ·Tagged

Quantum chip research is in order to make the quantum technology can be applied in the daily life,MN102H74G price, such as quantum cryptography and higher performance of daily use quantum computer.

Recently by the Austria Innsbruck University led by Dr GregorWeihs Austria and Canadian scientists organized a group of first in laboratory a gallium arsenide semiconductor realized made feasible a photon pair source. According to the experimental data, the chip has a higher power loss. But according to Dr GregorWeihs describes,” the effect was very good, this condition has received good signal.” The breakthrough to accelerate the daily use of quantum optical components manufacturing and information quantization process. Read the rest of this entry »

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Filigree Sen Mei introduced a new tunable optical LED drive module

May 17, 2012 at 3:25 pm · Filed under ic market trends ·Tagged

Dedicated to providing help power management,AD8073JN datasheet, safe, reliable and high performance semiconductor technology is a leading supplier of products filigree Sen Mei company ( Microsemi Corporation, New York’s NASDAQ symbol: MSCC ) launched a global around the residential, commercial and industrial lighting and optimization of novel tunable optical LED drive module. This new30W LXMG221W-0700030-D0it LED drive can achieve150 ms ( MS ) or faster startup time, highly follow typical incandescent lamp” light” performance, for the unacceptable lamp start-up delay family and commercial application is very important. Filigree Sen Mei new solid-state LED drive meets energy star ( ENERGY STAR-compliant ) requirements, provides overvoltage and overcurrent protection, and automatic hot shutdown, contribute to the realization of safe operation.

According to industry analysis firm Strategies Unlimited estimates, in 2011 the commercial, industrial and residential LED lighting market scale of nearly $3000000000( not including the lamp replacement). From 2011to 2016, the overall LED lighting market is expected to close to 20% compound annual growth rate of increase.

Metro business development director Sen Mei Irene Signorino said:” mandatory phase-out inefficient incandescent lamp of the implementation of laws and regulations, in the global drive includes energy-saving LED lights instead of light growth. Our new LED driver makes the lamp manufacturer can through this growth in the market the opportunity to profit. We will remain committed to lighting and power application of professional knowledge, to solve challenging problems the industry.”

High power LED lamp in household and commercial application of the growing popularity of. However, this kind of application users have come to expect instant lighting incandescent lamp performance, its importance even more than the advantage of energy saving. Filigree Sen Mei new LED driver can provide150ms or shorter starting time, will not be visible to the naked eye detection, so as to solve the problem. The characteristics and the new drive size and power / current level, make it become the” instant light” ideal lighting applications.

On the LXMG221W-0700030-D0

Filigree Sen Mei new LED compatible drives around the world in 50Hz and 60Hz AC power supply, standard voltage range from 120VAC to + / – 10% to277 VAC + / – 10%. The output of 700MA ( mA ) light adjustable constant current source. The drive with UL, CUL, CE and EMC industry standard. Additional features include:

And high voltage AC input (90-305VAC ), which is installed in the world

, constant current700mA single string application, implementation using 5-12LED without flicker (maximum 30W output output )

Under full load, covering the entire range of input voltage to achieve high power factor ( PF > 0.9) and low total harmonic distortion ( THD < 15% ), to meet or exceed the standard requirements.

Through0-10VDC (IEC60929provisions), adjustable light to 10%, the use of PWM control or the potentiometer can be further energy saving.

, with FCC forty-seventh, fifteenth Class B standard Read the rest of this entry »

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Agilent launches four new X series high performance signal generator

May 17, 2012 at 3:24 pm · Filed under Core product release ·Tagged

Agilent Technologies Company has announced the launch of four new X series signal generator can provide incomparable, phase noise,AD7111CQ price, output power, ACPR, EVM and bandwidth. With the help of these functions, the new Agilent MXG and EXG products ( provide analog and vector model) support components and receiver development, can eliminate interference, accelerate the data throughput and improving military radar, communication and consumer wireless technology applications such as signal quality.

Today’s aerospace and defense environment requires the use of enhanced performance of radar to detect distant and faint signal. In order to test the design requirements of the clean, precise signal, MXG uses innovative tricyclic synthesizer, in 1GHz frequency offset20 kHz with – 146 dBc / Hz phase noise. MXG also have the industry’s leading -96 dBc (1 GHz ) spurious performance, applicable to the radar component developers ( such as mixer and converter ).

In the field of wireless communication, the user needs more data and better coverage, this demand is driving the consumer equipment and network infrastructure towards higher performance. When the designer for 802.11ac devices to develop a more high-speed data stream, MXG is the only provide a balanced160-MHz RF bandwidth and + 0.2 dB flatness solutions. To those who seek to enhance the frequency range, eliminates the signal interference and improve the performance of components of the user, MXG and EXG can provide three kinds of industry leading capabilities: low EVM, high up to + 27dBm output power and high up to – 73dBc ACPR ( W-CDMA test mode 1,64 DPCH ).

The vice president and general manager of Department of career of microwave communication with Andy Botka said: ” we continue to signal generation product innovation, for our customers to test its high performance device provides incomparable performance. Through the use of simple, complex, including signal signal signal signal clean and impaired, a plurality of signal, MXG and EXG can support a detailed measurement, so as to reveal the true performance of advanced design.”

As support for cellular communications, wireless connectivity, video and navigation signals, MXG and EXG are now available for complex real signal in real-time simulation. The Agilent Signal Studio software ( for acceleration signal generating flexible tools ) can now support the rapid changes in the standard and highly complex signal, such as GPS or GLONASS constellation diagram of the real-time simulation and performance test of LTE base station.

In the manufacture of test field, economic and efficient EXG to extend the normal operation time and rapid throughput ( switching speed is less than900 s) were optimized. EXG also provides basic parameters of components and functional verification of the desired signal receiver.

In order to reduce the cost of ownership, X series offers high reliability, fast and easy calibration, service and repair. Today’s MXG and EXG make full use of on the generation of MXG signal generator technology, they are Agilent provided the most reliable source. The recommended three years calibration cycle and self maintenance strategy can reduce the cost and increase the support equipment normal operation time. Read the rest of this entry »

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LED illumination driving power of choice points and constant current driving mode introduction

May 16, 2012 at 1:10 pm · Filed under ic market trends ·Tagged

LED is sensitive semiconductor device,DAC8820IBDB datasheet, and having a negative temperature characteristic, therefore in the process of application needs to carry on the stable working state and protection, which is driven by the concept of. The LED device to drive power demand almost harsh, LED unlike ordinary incandescent light bulb, can be directly connected to the 220V AC city electricity. LED is about 3 V low voltage driving, we must design a complex transform circuit, different uses of LED lights, should be equipped with different power adapter.

The international market for foreign customers for LED driving power supply efficiency conversion, effective power, constant current power, precision, life electromagnetic compatibility requirements are very high, the design of a good power supply must be integrated into these factor, because the power supply in the lighting in the role is as important as the human heart.

According to the power grid electricity rules and LED driving power requirements, the selection and design of LED driving power to consider the following points:

In 1, high reliability

Like LED lamp driving power, installed in the high altitude, inconvenient repair, repair costs are.

In 2, high efficiency

LED is energy-saving products, to high efficiency driving power supply. The power supply is installed on a lamp inside the structure, is particularly important. Because the luminous efficiency of LED with LED temperature rising and falling, so LED heat is very important. Power supply efficiency is high, its power dissipation is small, the lamp heat is small, it reduces the lamp temperature rise. To delay the LED lumen is favorable.

In 3, the high power factor

Power factor is the power to the load requirements. Generally below 70 watts of electrical appliances, not mandatory targets. Although the small power single electric power factor low point on the grid had little effect, but the night everyone lighting, similar load too concentration, will produce more serious pollution to power grid. For30watts to 40 watts of LED drive power, said that the near future, perhaps will be on power factor has certain requirements.

4, driving mode

The current has two kinds: one is a constant voltage source for a number of constant current source, each constant current source to separate each LED power supply. In this manner, flexible combination, a LED fault, does not affect the other LED’s work, but the cost will be slightly. Another is the direct constant-current power supply, LED series or parallel operation. Its advantages are low cost a little, but poor flexibility, but also solve a LED fault, does not affect the other LED operation problem. The two, for a period of time to coexist. A constant current output power supply mode, the cost and performance will be better. Maybe the next mainstream direction.

5, surge protection

LED anti surge capacity is relatively poor, especially anti reverse voltage capability. Strengthen the protection is very important. Some of the LED lamp is installed in the outdoor, such as LED road lamp. As a result of power grid load and flings and lightning induction, from the grid system may invade the various surge, some surge causes LED damage. Therefore LED driving power to suppress the surge intrusion protection, LED is not damaged the ability.

6, the protection function

Supply in addition to conventional protection function, preferably in a constant current output to increase LED temperature negative feedback, to prevent the LED temperature is too high.

7, the protection of

Lighting installation, the power structure to waterproof, moisture-proof, shell to light.

8, driving power of life and the life of LED matched.

In 9, to comply with the safety and electromagnetic compatibility requirements.

With the increasingly wide application of LED, LED driver of performance will be more suitable for the requirements of LED.

Due to the LED power level limit, usually while driving a plurality of LED to meet the brightness demand, therefore, require special driving circuit to turn on the LED. Following a brief current mainstream several LED driving method:

1, isolated flyback circuit

Use of flyback circuit through the transformer secondary side, in the DC level, the level through the optocoupler feedback back to the original side ripple, thus self stability. Compliance with the regulatory requirements identified in such a circuit, and the output current accuracy, higher conversion efficiency. But due to the need of optocoupler and side constant flow control circuit, leading to complex system, large volume, high cost. Currently has a primary scheme for replacing.

In 2, a resistance-capacity decompression

Use of capacitance in AC impedance to limit the input current, thereby obtaining the DC level for LED power supply. This driving mode has the advantages of simple structure, low cost, but the input non-isolated scheme, having safe hidden trouble. And the conversion efficiency is very low, cannot achieve constant current control.

In 3, the original boundary scheme

The original edge is by completely in the AC side of the original control output power and current, the most precise can be done with 5% precision constant current, side edge only need a simple output circuit. The original edge relies mainly on auxiliary boundary feedback to control the output voltage, a current-limiting resistor to rely on primary side current control, at the same time multiplied by turns to control the accuracy of output current. The original boundary scheme inherited isolated flyback circuit advantages, at the same time, simple structure, small volume and low cost can be done, at present has become the main drive.

The original edge precision constant current problem: because PSA production control, led to the side of the original program in the use of low quality of the transformer, the output current drift is larger. So, the original boundary scheme through improved increased side constant flow control circuit, although this than ordinary primary scheme is complex, but the contrast of flyback scheme, can still save optocoupler, system sex price ratio is maximal. Read the rest of this entry »

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The Spanish company plans to develop the CMOS process of monolithic MEMS inertial sensors

May 16, 2012 at 1:08 pm · Filed under Core product release ·Tagged

One is located in Spain Barcelona startups Baolab Microsystems SL announced plans to adopt the company,UC2901N Suppliers, is a new technology, to develop reconfigurable inertial sensor unit ( IMU ). Baloab Microsystems SL is the first in the CMOS wafer metal interconnection layer in the development of microelectromechanical systems ( MEMS ) components of the company.

Baolab has been developed based on the company’s unique technology3D compass. The company also said, is expected in the technical modifications, can further dimension into the accelerometers and gyroscopes, and then developed a new IMU. However, Baolab does not indicate when to use CMOS technology by formal production multi-axis accelerometer or gyroscope.

Combined with the three axis accelerometer, gyroscope and magnetometers, can provide the absolute position and orientation data. This kind of product is usually combined with satellite data, in a mobile device application to provide a position sensing function.

” We have developed to modify our development 3D NanoCompass product architectures for development, gyro, accelerometer and magnetometer, Baolab CEO Dave Doyle said. ” Because we can have on a single chip at the same time integration of a variety of different sensors and electronic components, at the same time provides control functions and intelligent characteristics, therefore, we will create a desired product industry — multi sensor IMU, this new element will have a more flexible characteristics, according to requirements of different applications to dynamic configuration.”

In general, MEMS, analog signal conditioner, and a digital signal processing will need three different processes. These elements are usually adopts multiple chip package, so that they have become the digital output of the MEMS element. By the CMOS chip in the metal layer of integrating MEMS framework, Baolab claims to be able to issue a monolithic multiple unit MEMS element.

” Our goal is to develop low cost, with intelligent characteristics of multi sensor NanoIMU products, the future we will launch a series of nanosensors,” said Doyle. Read the rest of this entry »

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